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GALLIUM NITRIDE TECHNOLOGY
REINVENTED​

Unleashing true power of 5G
​With 
CUTTING EDGE 3DGAN TECHNOLOGY 

Cambridge electronics is now Finwave semiconductor!

Solving the power Efficiency challenge

    5G, the next generation of wireless technology with 100x faster data rate than 4G, 1000x more capacity and ultra low latency 1, is going to drive the technology and business revolutions in the next 10 years such as  digitalization for cities, factories and agriculture 2.
    However, a big challenge of rolling out the 5G service is very low power efficiency in producing the ultra-band-width 5G radio waves
. For example, the new 5G phones suffer from severe battery drain issues caused by the 5G RF chips 3. 
    Datacenters for high performance cloud computing is another area where energy efficiency is critical. Today datacenters consume 2-3 percentage of global electricity production 4. The energy consumption is expected to grow further due to the increasing amount of data expected to be stored and processed in the cloud. 
     ​Our 3DGaN technology is developed to solve the energy efficiency challenges to enable the true potential of 5G and the future of sustainability.
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News & Blog
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Finwave Semiconductor Addresses the 5G Challenge with Breakthrough 3DGaN™ FinFET Technology
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Cambridge Electronics is selected as one of the awardees for ARPA-E SCALEUP project.
Jan. 2021
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We joined Plug & Play 2020 Spring Session

Mar. 2020
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We are now in The Engine

Feb. 2018

Partners and Investers

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